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Home > Products > Contact Card Production Line > 220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

Product Details

Place of Origin: China

Brand Name: YL

Model Number: YCGP-1

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: negotiable

Packaging Details: 1 plywood case

Delivery Time: 30-35days

Payment Terms: T/T,Western Union,MoneyGram

Supply Ability: 1 set per 35 days

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Product Details
Highlight:

PLC Program Control IC Chip Tape Glue Preparation Machine

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Hot Welding Glue Preparation Contact IC Card Machine

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9000-18000 Chips/Hour IC Card Glue Applicator

Power:
Around 1.0kiw
Power Supply:
AC220V 50/60 HZ
Compressed Air:
6kg/cm²(dry Oil Free)
Spped 1:
9000~12000chips/hour( 2 Times Of Hot Welding)
Spped 2:
15000~18000chips/hour( 1 Time Of Hot Welding)
Module Specification:
ISO Standard Contact IC Card Chip Tape (M3/8-pin & M2/6-pin)
Power:
Around 1.0kiw
Power Supply:
AC220V 50/60 HZ
Compressed Air:
6kg/cm²(dry Oil Free)
Spped 1:
9000~12000chips/hour( 2 Times Of Hot Welding)
Spped 2:
15000~18000chips/hour( 1 Time Of Hot Welding)
Module Specification:
ISO Standard Contact IC Card Chip Tape (M3/8-pin & M2/6-pin)
Product Description
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 
Professional automated machine for 6-pin and 8-pin contact IC chip tape glue preparation with hot welding technology.
Machine Overview
The YCGP-1 machine features PLC program automatic control and utilizes imported high-quality stepper motors for precise transportation of IC module strips and hot melt glue. This ensures fast production speeds and high glue preparation precision.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 0
Key Features
  • Integrated system for IC module strip transportation, hot melt adhesive strip handling, glue flushing, hot welding preparation, and finished product collection
  • Hot welding glue preparation welding head with automatic correction and balance structure for superior glue preparation and convenient debugging
  • Hot welding and glue punching molds equipped with position fine-tuning mechanism for higher punching precision and easier operation
  • Modular mold structure design enables quick and easy replacement for different IC module types
  • Automatic monitoring and protection system with electric sensor eye for IC module stepping position
  • Automatic material belt discharge and receiving with alarm and shutdown for empty feed conditions
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 1
Technical Specifications
Parameter Specification
Power AC220V 50/60 HZ
Main Power Approximately 1.0 KW
Operator 1 person
Compressed Air 6kg/cm² (dry oil free)
Air Consumption Approximately 30L/min
Net Weight Approximately 400Kg
Control Mode PLC + stepper system
Speed 9,000-12,000 chips/hour (2 times hot welding)
15,000-18,000 chips/hour (1 time hot welding)
Bonding Mode Hot melt glue (Tesa 8410, Scapa G175 or similar)
Module Specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine Size Approximately L1700×W800×H1600mm
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 2
Applications
The YCGP-1 machine is designed for the preparation and processing of various types of contact IC chip or module tapes, including 6-pin and 8-pin chip configurations.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 3