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Huis > producten > productielijn voor contactkaarten > 220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

Productgegevens

Plaats van herkomst: China

Merknaam: YL

Modelnummer: YCGP-1

Betalings- en verzendvoorwaarden

Min. bestelaantal: 1 set

Prijs: negotiable

Verpakking Details: 1 Multiplex koffer

Levertijd: 30-35 dagen

Betalingscondities: T/T,Western Union,MoneyGram

Levering vermogen: 1 set per 35 dagen

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Productgegevens
Markeren:

PLC Program Control IC Chip Tape Glue Preparation Machine

,

Hot Welding Glue Preparation Contact IC Card Machine

,

9000-18000 Chips/Hour IC Card Glue Applicator

Stroom:
ongeveer 1,0kiw
Voeding:
AC220V 50/60 HZ
Gecomprimeerde lucht:
6 kg/cm2 ((droge olievrij)
sppd 1:
9000~12000 stukjes/uur ((2 keer warm lassen)
gespede 2:
15000~18000 stukjes/uur ((1 keer warm lassen)
Specificatie van de module:
ISO-standaard contact-IC-kaartchipband (M3/8-pin & M2/6-pin)
Stroom:
ongeveer 1,0kiw
Voeding:
AC220V 50/60 HZ
Gecomprimeerde lucht:
6 kg/cm2 ((droge olievrij)
sppd 1:
9000~12000 stukjes/uur ((2 keer warm lassen)
gespede 2:
15000~18000 stukjes/uur ((1 keer warm lassen)
Specificatie van de module:
ISO-standaard contact-IC-kaartchipband (M3/8-pin & M2/6-pin)
Productbeschrijving
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 
Professional automated machine for 6-pin and 8-pin contact IC chip tape glue preparation with hot welding technology.
Machine Overview
The YCGP-1 machine features PLC program automatic control and utilizes imported high-quality stepper motors for precise transportation of IC module strips and hot melt glue. This ensures fast production speeds and high glue preparation precision.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 0
Key Features
  • Integrated system for IC module strip transportation, hot melt adhesive strip handling, glue flushing, hot welding preparation, and finished product collection
  • Hot welding glue preparation welding head with automatic correction and balance structure for superior glue preparation and convenient debugging
  • Hot welding and glue punching molds equipped with position fine-tuning mechanism for higher punching precision and easier operation
  • Modular mold structure design enables quick and easy replacement for different IC module types
  • Automatic monitoring and protection system with electric sensor eye for IC module stepping position
  • Automatic material belt discharge and receiving with alarm and shutdown for empty feed conditions
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 1
Technical Specifications
Parameter Specification
Power AC220V 50/60 HZ
Main Power Approximately 1.0 KW
Operator 1 person
Compressed Air 6kg/cm² (dry oil free)
Air Consumption Approximately 30L/min
Net Weight Approximately 400Kg
Control Mode PLC + stepper system
Speed 9,000-12,000 chips/hour (2 times hot welding)
15,000-18,000 chips/hour (1 time hot welding)
Bonding Mode Hot melt glue (Tesa 8410, Scapa G175 or similar)
Module Specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine Size Approximately L1700×W800×H1600mm
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 2
Applications
The YCGP-1 machine is designed for the preparation and processing of various types of contact IC chip or module tapes, including 6-pin and 8-pin chip configurations.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 3