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> 상품 > 연락 카드 생산 라인 > 220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

제품 세부 정보

원래 장소: 중국

브랜드 이름: YL

모델 번호: YCGP-1

지불 및 배송 조건

최소 주문 수량: 1세트

가격: negotiable

포장 세부 사항: 1 합판 케이스

배달 시간: 30-35일

지불 조건: T/T,웨스턴 유니온,머니그램

공급 능력: 35 일마다 1 개의 세트

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제품 세부 정보
강조하다:

PLC Program Control IC Chip Tape Glue Preparation Machine

,

Hot Welding Glue Preparation Contact IC Card Machine

,

9000-18000 Chips/Hour IC Card Glue Applicator

힘:
약 1.0kiw
전원공급장치:
교류 220V 50/60Hz
압축공기:
6kg/cm²(무유)
속도 1:
9000~12000칩/시간(2번의 열용접)
속도 2:
15000~18000칩/시간(1회 열용접)
모듈 사양:
ISO 표준 접촉 IC 카드 칩 테이프 (M3/8 핀 & M2/6 핀)
힘:
약 1.0kiw
전원공급장치:
교류 220V 50/60Hz
압축공기:
6kg/cm²(무유)
속도 1:
9000~12000칩/시간(2번의 열용접)
속도 2:
15000~18000칩/시간(1회 열용접)
모듈 사양:
ISO 표준 접촉 IC 카드 칩 테이프 (M3/8 핀 & M2/6 핀)
제품 설명
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 
Professional automated machine for 6-pin and 8-pin contact IC chip tape glue preparation with hot welding technology.
Machine Overview
The YCGP-1 machine features PLC program automatic control and utilizes imported high-quality stepper motors for precise transportation of IC module strips and hot melt glue. This ensures fast production speeds and high glue preparation precision.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 0
Key Features
  • Integrated system for IC module strip transportation, hot melt adhesive strip handling, glue flushing, hot welding preparation, and finished product collection
  • Hot welding glue preparation welding head with automatic correction and balance structure for superior glue preparation and convenient debugging
  • Hot welding and glue punching molds equipped with position fine-tuning mechanism for higher punching precision and easier operation
  • Modular mold structure design enables quick and easy replacement for different IC module types
  • Automatic monitoring and protection system with electric sensor eye for IC module stepping position
  • Automatic material belt discharge and receiving with alarm and shutdown for empty feed conditions
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 1
Technical Specifications
Parameter Specification
Power AC220V 50/60 HZ
Main Power Approximately 1.0 KW
Operator 1 person
Compressed Air 6kg/cm² (dry oil free)
Air Consumption Approximately 30L/min
Net Weight Approximately 400Kg
Control Mode PLC + stepper system
Speed 9,000-12,000 chips/hour (2 times hot welding)
15,000-18,000 chips/hour (1 time hot welding)
Bonding Mode Hot melt glue (Tesa 8410, Scapa G175 or similar)
Module Specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine Size Approximately L1700×W800×H1600mm
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 2
Applications
The YCGP-1 machine is designed for the preparation and processing of various types of contact IC chip or module tapes, including 6-pin and 8-pin chip configurations.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 3