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Rumah > Produk > jalur produksi kartu kontak > 220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

Rincian produk

Tempat asal: Cina

Nama merek: YL

Nomor model: YCGP-1

Syarat Pembayaran & Pengiriman

Kuantitas min Order: 1 set

Harga: negotiable

Kemasan rincian: 1 Kotak Kayu Lapis

Waktu pengiriman: 30-35 hari

Syarat-syarat pembayaran: T/T, Western Union, MoneyGram

Menyediakan kemampuan: 1 set per 35 hari

Dapatkan Harga Terbaik
bicara sekarang
Rincian produk
Menyoroti:

PLC Program Control IC Chip Tape Glue Preparation Machine

,

Hot Welding Glue Preparation Contact IC Card Machine

,

9000-18000 Chips/Hour IC Card Glue Applicator

Kekuatan:
sekitar 1,0kiw
Catu daya:
Tegangan AC220V 50/60Hz
Udara Terkompresi:
6kg/cm²(kering bebas minyak)
kecepatan 1:
9000~12000chips/jam (2 kali pengelasan panas)
spped 2:
15000 ~ 18000 chip/jam (( 1 kali pengelasan panas)
Spesifikasi modul:
Pita chip kartu IC kontak standar ISO (M3/8-pin & M2/6-pin)
Kekuatan:
sekitar 1,0kiw
Catu daya:
Tegangan AC220V 50/60Hz
Udara Terkompresi:
6kg/cm²(kering bebas minyak)
kecepatan 1:
9000~12000chips/jam (2 kali pengelasan panas)
spped 2:
15000 ~ 18000 chip/jam (( 1 kali pengelasan panas)
Spesifikasi modul:
Pita chip kartu IC kontak standar ISO (M3/8-pin & M2/6-pin)
Deskripsi Produk
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 
Professional automated machine for 6-pin and 8-pin contact IC chip tape glue preparation with hot welding technology.
Machine Overview
The YCGP-1 machine features PLC program automatic control and utilizes imported high-quality stepper motors for precise transportation of IC module strips and hot melt glue. This ensures fast production speeds and high glue preparation precision.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 0
Key Features
  • Integrated system for IC module strip transportation, hot melt adhesive strip handling, glue flushing, hot welding preparation, and finished product collection
  • Hot welding glue preparation welding head with automatic correction and balance structure for superior glue preparation and convenient debugging
  • Hot welding and glue punching molds equipped with position fine-tuning mechanism for higher punching precision and easier operation
  • Modular mold structure design enables quick and easy replacement for different IC module types
  • Automatic monitoring and protection system with electric sensor eye for IC module stepping position
  • Automatic material belt discharge and receiving with alarm and shutdown for empty feed conditions
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 1
Technical Specifications
Parameter Specification
Power AC220V 50/60 HZ
Main Power Approximately 1.0 KW
Operator 1 person
Compressed Air 6kg/cm² (dry oil free)
Air Consumption Approximately 30L/min
Net Weight Approximately 400Kg
Control Mode PLC + stepper system
Speed 9,000-12,000 chips/hour (2 times hot welding)
15,000-18,000 chips/hour (1 time hot welding)
Bonding Mode Hot melt glue (Tesa 8410, Scapa G175 or similar)
Module Specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine Size Approximately L1700×W800×H1600mm
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 2
Applications
The YCGP-1 machine is designed for the preparation and processing of various types of contact IC chip or module tapes, including 6-pin and 8-pin chip configurations.
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 3